HTSP Silicone Heat Transfer Plus

Silicone Heat Transfer Compound Plus

HTSP is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal coupling of electronic components.

HTSP is based on a silicone oil, offering an exceptionally wide operating temperature range.

• High thermal conductivity; optimum efficiency of heat dissipation
• Very low viscosity for ease of application; designed for use as a thermal interface material
• Based on a silicone oil; offers an exceptionally wide operating temperature range
• Non-curing paste; allows simple and efficient rework of components if required