As edge AI continues to evolve, more powerful and efficient solutions are emerging. Innodisk introduces the AI on ARM series, featuring the EXMP-Q911 COM-HPC Mini Module powered by Qualcomm’s Dragonwing™ IQ-9075 SoC.
Combining high performance and low power consumption, the EXMP-Q911 delivers reliable computing and seamless module compatibility to accelerate diverse AI applications. It supports a wide operating temperature range of -40°C to 85°C, ensuring resilience in harsh industrial environments, and offers rich I/O interfaces, including 2 × 2.5GbE, 2 × 4-lane MIPI CSI-2, and PCIe Gen4, enabling greater flexibility for edge AI deployment.
Powered by Qualcomm’s Latest AI SoC
Leveraging Qualcomm’s new Dragonwing™ AI SoC, the module delivers up to 100 TOPS (Dense) or 200 TOPS (Sparse) of powerful edge AI computing.
Compact COM-HPC Mini Architecture
Built on the COM-HPC Mini standard, the EXMP-Q911 achieves exceptional performance within a compact and efficient hardware footprint.
Streamlined Development with IQ Studio
Innodisk has developed IQ Studio – a quick-start platform featuring BSPs, AI sample applications, benchmarking, and testing tools to bring AI to market faster.
Proven Real-World AI Performance
Validated with real-world benchmarks for Vision and Generative AI.
QUALCOMM IQ9 SERIES EXMP-Q911 I 2025 – HIGHLIGHT FEATURES
- Powered by Qualcomm Dragonwing QCS9075
- Provides up to 100 TOPS of AI processing performance at low power with Hexagon NPU
- Accelerates AGV, AMR, and LLM applications at the edge with unparalleled performance
- 128GB UFS 3.1 storage, up to 36GB onboard memory
- Dual 2.5G Ethernet, dual 4-lane MIPI CSI-2
- COM-HPC Mini form factor
- Longevity: Chipset supported through 2038
Please contact Vepac electronics on 0114548053 or sales@vepac.co.za for further assistance
