TBS Thermal Bonding System

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Description

Thermal Bonding System

TBS is a two-part, thermally conductive epoxy system, designed for bonding applications at thermal interfaces. It is ideal for use as a bonding medium in surface mounting assemblies and where the design of heat sinks does not allow for welding or brazing techniques to be employed due to complexity or geometry of the fins.

  • High bond strength and excellent adhesion; provides an alternative to welding techniques
  • Very good thermal conductivity; optimum efficiency of heat dissipation
  • Contains solid glass spheres; aids application by controlling the correct coating thickness
  • Room temperature curing; simple mixing and curing procedures for ease of use

[ pdf Datasheet (267 KB) ]