HTSP Silicone Heat Transfer Plus

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Description

Silicone Heat Transfer Compound Plus

HTSP is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipated efficiently, ensuring the reliable thermal coupling of electronic components.

HTSP is based on a silicone oil, offering an exceptionally wide operating temperature range.

  • High thermal conductivity; optimum efficiency of heat dissipation
  • Very low viscosity for ease of application; designed for use as a thermal interface material
  • Based on a silicone oil; offers an exceptionally wide operating temperature range
  • Non-curing paste; allows simple and efficient rework of components if required

[ pdf Datasheet (121 KB) ]