HTCP Non Silicone Heat Transfer Compound

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Description

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders.  These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

HTCP contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear.  Similarly soldering problems caused by silicones will not be encountered.  HTCP should be used where a large amount of heat needs to be dissipated quickly and effectively.  The heat dissipation from the source (e.g. semiconductor barrier layer) is achieved through many layers of different material before the heat is dissipated through free or forced convection.

It should be noted that the use of a thermally conductive paste will only aid the dissipation of heat if the interface where it is used has the lowest thermal conductivity within the system, i.e. is the rate determining step.  This is usually the case. The rate at which heat flows is dependant on the temperature differential, the thickness of the layer, and the thermal conductivity of the material. A full range of heat transfer products are available from Electrolube.

This range includes silicone and non-silicone based pastes (HTS & HTC), an RTV rubber (TCR), an adhesive epoxy (TBS) and an epoxy based potting resin (ER2074). A silicone version of this material is also available, order code HTSP.

[ pdf Datasheet (38 KB) ]